MA, Zhenghan. Application of Thermal Imagery Technology for Fault Detection of Large Electrical Equipment and Microelectronic components. Computers and Artificial Intelligence, [S. l.], v. 3, n. 3, p. 217–222, 2026. DOI: 10.70267/cai.26v3n3.217222. Disponível em: https://journals.zeuspress.org/index.php/CAI/article/view/1004. Acesso em: 26 jul. 2026.