Review of the WTO Compliance of Subsidy Measures in the U.S. and EU Chip Acts and China’s Countermeasure Strategies

Main Article Content

Siyu Liu
Department of Law, School of Humanities and Law, North China University of Technology, Beijing 100144, China

DOI: https://doi.org/10.70267/ijassr.260302.102112

Keywords

U.S. and EU Chip Acts, WTO compliance, SCM Agreement, non-discrimination principle, subsidy measures, China’s countermeasure strategies

Abstract

Since 2022, the United States has enacted the CHIPS and Science Act, and the European Union has adopted the European Chips Act. Both have implemented massive fiscal subsidies, tax incentives, and other support measures to expand domestic semiconductor manufacturing capacity, while also incorporating so-called “guardrail clauses” that restrict investment in China. Taking WTO rules as the analytical framework, this paper systematically examines the WTO compliance of these measures based on the Agreement on Subsidies and Countervailing Measures (SCM Agreement) and the non-discrimination principles under GATT 1994. On this basis, the paper proposes that China should establish a multi-dimensional response system to address the impact of unilateralism on the global semiconductor industry chain and the multilateral trading system.

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References

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Published
Apr 13, 2026
Issue
Vol. 3 No. 2 (2026)
Section
Research Articles
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How to Cite

Siyu Liu. (2026). Review of the WTO Compliance of Subsidy Measures in the U.S. and EU Chip Acts and China’s Countermeasure Strategies. International Journal of Asian Social Science Research , 3(2), 102-112. https://doi.org/10.70267/ijassr.260302.102112